Top modules
	Process modules MEMaterial (Database) AnisE (Anisotropic etch) IntelliMask (Layout) IntelliFAB (Process visual.) Analysis modules Thermoelectromechanical Packaging PiezoMEMS ElectroMagnetics & RF MEMS BioMEMS & MicroFluidics System modeling System model extraction Economic modeling MEMS Cost Module

General features

• Rich Windows compliant user experience
• UI taylored for ease of learning and use
• Rich visual graphics
• 3d device representation
• Mask creation
• Process flow and process modeling
• Full device analysis and behavior extraction
• Thin film material database
• Material properties as function of processing parameters
• Anisotropic etch simulator
• Physics simulators for coupled simulations in the following domains: mechanics, electrostatic, electromagnetic, fluidic, piezoresistive,thermal.
• Import/Export filters to various industry standard data formats

General Analysis Features

• Linear and non-linear analysis
• Static, steady state, and transient analysis
• Fully 3D coupled dynamics analysis
• Parametric variation of parameters
• Takes into account fabrication process-induced effects
• Submodeling, symmetry, and other size reducing techniques
• Animation and color mapping of results
• Export and import to/from other engineering CAD tools

Electrostatic, ThermoMechanical, and fully 3D coupled ThermoElectroMechanical

• Displacement due to voltage and thermal loading
• Capacitance due to voltage and thermal deformation
• Pull-in voltage, contact and hysteresis loop calculations
• Full multi-dielectric capabilities
• Stress, temperature, potential, charge, and pressure distribution
• Joule/resistive heating actuation
• Assembly and latching analysis
• Post-assembly coupled analysis
• Natural frequency and mode shapes as a function of loading
• Heat transfer: radiation, conduction, and convection

• Displacement and deformation due to voltage loading
• Natural frequency and mode shapes as a function of loading
• Stress distribution
  
  Electromagnetic-Mechanical
  
• Impedance matrix, inductance, and force distribution calculations
• Low frequency electromagnetic actuation
• High and low frequencies EM simulation of packaging delay and cross-talk
• High and low frequencies EM simulation of micro-antennas and micro-motors
• High frequency electromagnetic simulation for RF devices S-parameter extraction
  

  Fluidic analysis

  • Electro-osmotic flow
  • Porous media flow
  • Squeezed film liquid and gas damping
  • Charged particle flow
  • Heat transfer
  • Electrophoresis
  • Channel flow

  3D Fluid-Thermo-Mechanical
  

  • Transient squeezed-film damping (with thermal/electrical actuation)
  • Microchannel fluid flow, micromixing chambers, and micro heat exchangers
  • 3D Multi-phase flow with moving interfaces
  • 3D Fluid-structure interaction with deformable structures
  • Membrane pumps, flapper valves, etc.Full ink-jet nozzle jet simulations

  Material database

• Predict mechanical, electrical, thermal, physical, optical, and other material properties as a function of processing parameters
• Over 70 materials in database
• User database creation
• Process optimization and estimation routines
• Linked to IntelliSuite

Anisotropic etch simulation

• Simulate <100> or <110> wafer orientation etching
• Simulate etching under different time, temperature, and concentration parameters
• Access TMAH and KOH etch-rate databases, or use customized etch-rate data
• Etch the top, bottom, or both sides of a wafer
• Implement multiple protective etch stops
• Perform multiple etchings with different masks on a single wafer
• Study the effects of misalignments and other process deviations
• Determine the effects of vertical etching coupled with anisotropic etching
• Perform 3D geometric visualization and cross-sectioning
• Take distance measurements on the etched wafer
• Visualize and export 3D results in DXF and VRML formats

Additional features

• Residual pre-stressing due to fabrication
• Multiple dielectric layers
• Squeezed film liquid and air damping
• Fully 3D dynamic analysis
• Electrostatic charge distribution
• Linear and non-linear models
• Behavioral model output
• True contact analysis
• Multiple dielectric layers
• Snap-down voltage
• Switching time
• Hysteresis
• Frequency shift vs. voltage bias
• Electrostatic charge distribution
• High frequency EM simulation
• Packaging delay
• Cross-talk
• S-Parameter extraction
• Fully 3D dynamic analysis
• Linear and non-linear models
• Device behavioral model output
• Electrostatic pressure distribution
• Electrostatic charge distribution
• Capacitance matrix results
• Joule Heating
• Hysteresis
• AC voltage loading