 |
|
|
|
|
|
|
|
|
IntelliSense and IC Knowledge have announced a new MEMS cost modeling software product.
The MEMS Cost Model is designed to enable users to easily estimate manufacturing costs. The cost model, which runs inside of Excel, allows the user to understand the impact of process choice and chip design on the final cost of the chips.
The software outputs include the breakout of fab, operating costs, wafer costs, and, as well as cost to build a suitable wafer fabrication facility.
The product is designed to serve the needs of anyone interested in understanding the manufacturing costs of MEMS.
Read full story…
|
Infotonics Technology Center and IntelliSense announced a strategic alliance aimed at lowering the barriers to entry in the MEMS market. We are now able to offer a “Total MEMS solution™” including market research services, design kits, CAD/EDA tools for MEMS based on IntelliSense's leading IntelliSuite® product, design services, chip prototyping services, MEMS and optical packaging services, and pilot production facilities.
Both companies will combine resources to develop MEMS and nanotechnology prototypes and move technologies into high yield and low cost commercial markets quickly and efficiently.
Read full story …
|
IntelliSense has established a China Branch to access both the immense talent and the growing market opportunities in the People's Republic. IntelliSense China has taken over the distribution of and training for our products throughout China.
In the last few months, IntelliSense China has started to get into gear. Yie He, President of IntelliSense China, has been recently appointed as a guest professor at the South East University of Nanjing. In addition, the company has signed an agreement with the MicroElectronics Institute at the University of Peking. University of Peking will act as a Designated Support Provider and a Technology Support Center for IntelliSuite.
|
We're introducing a new class of tools for reducing model complexity. Based upon cutting-edge, Krylov-subspace-based-model-reduction algorithms, very large nonlinear thermoelectromechanical FEM/BEM models can be reduced into computationally efficient behavioral models. These models, which go well beyond linear 6-DOF ROMs, fully capture the complex nonlinear dynamics inherent in MEMS due to electrostatic forces, residual stresses, squeeze film damping, and multiple mechanical degrees of freedom.
IntelliSuite system models can also be output to various HDLs.
Read full story
|
IntelliSense demonstrated many of the features of the next version of IntelliSuite. These include:
Language Independent Scripting Support
Most MEMS designs are multi-parametric optimization problems. IntelliSense introduces scripting support for a variety of languages, including Visual Basic, Perl, and Python. This capability will allow users to efficiently generate models and set up detailed simulations for a variety of MEMS devices.
IntelliMask Improvements
IntelliMask, IntelliSuite's MEMS-specific layout editing tool, now includes support for parametric elements and PCell-based hierarchy. These features combine with IntelliMask's existing capabilities to result in a powerful tool that allows for rapid development of complex layouts. These features are the latest in a series of improvements to IntelliMask, which began in early 2004 with a complete overhaul of the user-interface.
Vendor independent package creation tools
Neglecting packaging considerations up front can cause tremendous difficulties in later stages of a MEMS design cycle. To this end, IntelliSuite includes vendor- independent tools for package and leadframe creation, including Single- and Dual- Inline Pin (SIP/DIP), Small Outline IC (SOIC) and Quad Flat Pack (QFP). In addition, the properties for many common packaging materials are being integrated into MEMaterial MEMS processing material database.
|
|
|
|
|
 |
