IntelliSense announces new IntelliSuite features at ICMENS 2004.

August 27, 2004 (Banff, AB) IntelliSense Software Corporation is proud to announce the latest enhancements to the IntelliSuite Software Tools for the MEMS Professional.

System Model Extraction

IntelliSense introduces a new class of tools for reducing model complexity. Based upon cutting-edge, Krylov subspace based model reduction algorithms, very large non-linear thermoelectromechanical FEM/BEM models can be reduced into computationally efficient behavioral models. These models, which go well beyond linear 6-DOF ROMs, fully capture the complex non-linear dynamics inherent in MEMS due to electrostatic forces, residual stresses, squeeze film damping, and multiple mechanical degrees of freedom. IntelliSuite system models can be output to VHDL-AMS, Verilog-AMS, and MAST formats, with additional planned support for Matlab and Modelica.
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Language Independent Scripting Support
Most MEMS designs are multi-parametric optimization problems. IntelliSense introduces scripting support for a variety of languages, including Visual Basic, Perl, and Python. This capability will allow users to efficiently generate models and set up detailed simulations for a variety of MEMS devices.

IntelliMask Improvements
IntelliMask, IntelliSuite's MEMS-specific layout editing tool, now includes support for parametric elements and PCell-based hierarchy. These features combine with IntelliMask's existing capabilities to result in a powerful tool that allows for rapid development of complex layouts. These features are the latest in a series of improvements to IntelliMask, which began in early 2004 with a complete overhaul of the user-interface. These features, which have been made available to select customers for beta-testing, will be released in late 2004.

Packaging Analysis
Neglecting packaging considerations up front can cause tremendous difficulties in later stages of a MEMS design cycle. To this end, IntelliSuite includes vendor-independent tools for package and leadframe creation, including Single- and Dual- Inline Pin (SIP/DIP), Small Outline IC (SOIC) and Quad Flat Pack (QFP). In addition, the properties for many common packaging materials are being integrated into our MEMaterial MEMS processing material database.