Feature complete

In 1995, we released the first fully coupled thermo-electro-mechanical (TEM) analysis tool for MEMS and MEMS packaging. Since then, our TEM module has grown by leaps and bounds encompassing all aspects of modeling ranging from linear and non-linear behavior; steady state and transient analysis; static and dynamic behavior. In addition a bevy of enhancements now allow you to perform parametric loading, take into account processing conditions, or greatly reduce problems sizes by submodeling. In addition, you can use the tool to create macromodels for integration with system modeling tools.

The TEM module is packed with a chockful of features that are far too many to list here. And yes, we are confident that it will meet the needs of your most complex application. It is little wonder that then that IntelliSuite is used in corporations worldwide ranging from blue-chip to startups and is part of the MEMS curriculum in leading universities worldwide.

Thermal analysis

IntelliSuite gives you a full range of tools to model heat transfer phenomena. Designing a thermal actuator or a bolometer? Want to calculate thermal stresses during packaging? Want to model Joule heating or heat flux? No problem! This tool does it all. Or use the tool in conjunction with other analysis modules to calculate the temperature coefficient and response of your device.

Electrostatic analysis

The electrostatic module of IntelliSuite is designed from the ground up for real world MEMS problems, like a 200 radial comb drive or a corrugated RF-MEMS device. Other CAD tools run into severe limitations while solving real world problems and have to use toy models. Not IntelliSuite, with our innovative Exposed Face Meshing algorithms, you can now solve extremely large problems with ease. In fact, now you can even investigate second order effects such as levitation due to the ground plane (important in most comb drive structures), temperature coefficient of your capacitors, or charge buildup that can cause potential arcing.

Multi-dielectric problems, dielectric discontinuities, parasitic capacitance can all be modeled accurately without resorting to costly trial and error in the fab.

Mechanical analysis

One of the strong suits of IntelliSuite is its unparalleled capability in Mechanical analysis and its integration with the thermal and electrostatic modules to perform fully coupled analyses. IntelliSuite comes with a full featured mechanical module that can solve the most complex linear or non-linear, transient or steady state, static or dynamic problems. Stress and strain calculations, modal and buckling analysis, frequency responses, can be performed with ease. Full squeeze film damping, dynamic response to complex vibration inputs, shock analysis, Q factor calculations are equally easy to derive. Difficult problems such as the shift of natural frequency due to voltage or stress loading or the effect of residual processing stresses on device performance are easy to analyze.

Contact analysis and microassembly

IntelliSuite really shines when it comes to contact, post contact and microassembly analysis. While other MEMS CAD tools are limited to analyzing single dielectric layers, with artificial air stops, and make you specify contact faces a priori! IntelliSuite avoids such limitations. Our proprietary algorithms take into account multi-dielectric moving or deformable boundaries and help you locate the exact point of contact.

IntelliSuite's contact analysis goes way beyond the reduced order models and other gross simplifications and can help you model complex post-contact phenomenon such as hysterisis.

General analysis features

• Linear and non-linear analysis
• Static, steady state, and transient analysis
• Fully 3D coupled dynamics analysis
• Parametric variations
• Takes into account fabrication process-induced effects
• Submodeling, symmetry, and other size reducing techniques
• Animation and color mapping of results
• Export and import to/from other engineering CAD tools

Electrostatic analysis

• Electrostatic pressure, potential and charge distribution
• Capacitance matrix derivation
• Parasitic calculations

Mechanical analysis

• Stress-displacement calculations (principal and invariant stress calculations)
• Natural frequency and modal analysis
• Dynamic analysis with external force/acceleration loading
• Shock analysis
• Q factor calculation
• Damping analysis (including squeeze film effects)
• Definition of customized functions for external loading, upto 500 points in defining the curve
• Small and large displacement theory
• Residual stress incorporation
• Multiple simultaneous input loading
• Contact and post-contact analysis
• Hysterisis analysis
• Microassembly and latching modeling
• Popup and bistable elements

Thermal analysis

• Heat transfer problems
• Conduction or convection modeling
• Joule/resistive heating modeling
• Temperature distribution and gradients

Coupled analysis

• Exposed face meshing to decouple mechancial and electrostatic meshes resulting in performance enhancements
• Displacement due to voltage and thermal loading
• Capacitance due to voltage and thermal deformation
• Natural frequency shift due to voltage or temperature loading
• Pull-in voltage, contact and hysteresis loop calculations
• Full multi-dielectric capabilities
• Stress, temperature, potential, charge, and pressure distribution
• Joule/resistive heating actuation
• Assembly and latching analysis
• Post-assembly coupled analysis
• Natural frequency and mode shapes as a function of loading
• Heat transfer: radiation, conduction, and convection
• Squeeze film damping

Packaging/System modeling

• Full die and board level packaging modeling
• Thermo-mechanical analysis
• Effect of packaging in low pressure environment
• Incorporation of epoxies, dams, filler and getter materials
• Macromodel derivation of input to SPICE and related tools
• Advanced high frequency analysis and SPICE model generation in conjunction with Electromagnetic module (sold separately)