Extraction is performed in 3 stages. (a) The total strain and capacitance energy and fluid dissipation is captured (b) a Lagrangian Look Up Table (LUT) formulation is used to generate a description of the device and (c) the model is output into various HDLs for incorporation into EDA tools of your choice.

Lagrangian Formulation

System model extraction is based upon capturing the total energy within a MEMS device. Strain energy, electrostatic energy, fluidic dissipation and other damping terms are captured for each mode of interest. Sub-modeling techniques can be used to capture the interaction of the packaging related stresses on the device as well. Process related aspects such as residual stresses and strain gradients in films, orthotropic or anisotropic material properties, electrostatic levitation effects, thermal or packaging effects are fully captured in the resulting model. The extracted model is an arbitrary N-DOF 3D Model. User can use the 3D model to investigate dynamics of the MEMS device either locally or in full 3D .

As MEMS make their successful entry into mobile devices, the demand for slim profile packages becomes paramount. MEMS devices have started to leverage IC stacking technologies such as wafer bumping, die-on-wafer assembly, through-silicon vias (TSV) and towards low-cost Wafer Level Chip Scale Packages (WLCSP). As the MEMS subsumes the package into the structure, the need for efficient package modeling and compensation of packaging effects at the die level become important.

One of the most innovative features is the ability to include packaging effects on the device performance into the system models. Package extraction and sub-modeling techniques allow you to estimate the impact of the package stresses and temperature effects on the system performance.

Packaging analysis can now capture fluidic damping and spring force for complex MEMS structures. Our macromodel techniques now extend to fully capture fludic dissipation and automatically include ambient damping into system simulations. Fluidic damping can be captured for each of the modes of interest.

Feature Highlights

General features

Tightly integrated into IntelliSuite's Thermo-Electro-Mechanical analysis tools
Ability to define areas or points of interest within a model
Automated or semi-automated behavioral model extraction.
Three levels of behavioral models of varying complexity can be generated.
Level 1 models. Models based on rigid body approximations. These capture up to 6 mechanical DOFs and multiple electrical DOFs. Useful for designing readout electronics
Level 2 models: Accurately capture second order effects such as parasitics, non-linear deformation, temperature effects and package related effects. Useful for designing compensation electronics
Level 3 models: Fully capture harmonic and sub-harmonic response of the devices. Useful for designing active controls of MEMS.

Behavioral modeling features

Support for arbitrary electrical & mechanical DOFs. Capture moments of inertia (Ixx, Iyy, Izz, Ixy Iyz, Ixz), masses, 3D squeeze-film damping effects, non-linear spring constants (fully accounting for residual stresses and stress gradients)
Automated extraction of non-linear electrostatic forces (even for fringe field dominated devices)
Automatic calculation of modal contribution factors and modal energies. Fully capture of static, dynamic and harmonic response of devices
Behavioral model error bound estimation
Automatic formulation of device dynamics (Lagrangian formulation)

Model output

Model output to SYNPLE, Verilog-A, VHDL, PSPICE, HSPICE, Simulink (with purchase of EDA Linker)